Receive a quick response!
Ion Beam Milling provides wafer dicing services for all kinds of industries and applications that range from prototype research & development needs through high volume production.
Ion Beam Milling’s Disco dicing saws employ a thin, diamond blade mounted on a high-speed air bearing spindle and are equipped with microscopes and video feeds to ensure precision alignment. Equipment such as the Disco DAD321 saw also affords fully programmable operation.
Since 1982, Ion Beam Milling has processed both our own as well as our customer’s materials up to 6” (150mm) in diameter. In addition to standard materials, Ion Beam Milling can develop custom dicing and cutting procedures for almost any material required by our customers.
Typical materials include:
Of these materials, glass dicing is one of our most popular offerings. The flexibility afforded by our advanced dicing technology allows us to offer many different variations on the basic glass dicing procedure which affords applicability across many industries.
Depending upon the material, the cut width may be as small as 50 microns, and dies may be diced as small as .012" (300 microns).
Dicing thin wafers is one of Ion Beam Milling's specialties. As an alternative to our standard wafer dicing tape, when extra rigidity is called for, Ion Beam Milling can employ glass as the dicing base . In the case of thin wafers, the rigidity afforded by the glass significantly reduces chip out to less than 0.0005 mil in size.
We have extensive experience in dicing patterned wafers, substrates, and optically coated wafers
Please Contact Us for more information or to discuss how we can help you with your custom dicing project.