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Substrate Material Properties

Choosing the right substrate for your project is critical to your success.  The table below presents engineering data about many of the common substrate materials Ion Beam Milling works with.  We can however process just about any substrate material desired if none of the following meet your needs.

Our expert team of engineers is happy to consult with you on your project, so please contact us and we would be happy to assist you with your substrate selection.

Material

CLA Surface Roughness

(-inches)

Thickness Tolerance*

Dissipation Factor at 1 MHz

Dielectric Constant (k)

Thermal Conductivity (W /mk)

Thermal Expansion (ppm /C)

Polished Fused Silica (Quartz)

<.1

.0005

.000015

3.8

1

.56 (25-320C)

As Fired 96% Alumina

<35

.0005

.0004

9.5

26

6.3-8.0 (25-1000C)

As fired 99.6% Alumina

2-3

.001

.0001

9.9

30

7.0-8.3 (25-1000C)

Polished 99.6% Alumina

<1

.0005

.0001

9.9

30

7.0-8.3 (25-1000C)

Lapped Aluminum Nitride

<25

.0005

.001

8.6

170

4.6 (25-300C)

Polished Aluminum Nitride

<2

.0005

.0005

8.6

170

4.6 (25-300C)

Lapped 99.5% Beryllium Oxide

<20

.0005

.0004

6.5

270

9.0 (25-1000C)

Polished 99.5% Beryllium­ Oxide

<2

.0005

.0004

6.5

270

9.0 (25-1000C)

*Thickness Tolerance can be tighter as required. Please contact us to discuss your needs