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In addition to manufacturing custom circuits and standard thin-film products, Ion Beam Milling offers a range of services to our customers. All of the processes and procedures that we use to create circuits (photolithography, wafer etch, wafer dicing) are available on an a la carte basis.
Everything starts in the Photolithographic department where a photolithographic mask is created based upon the circuit design, and a photoresist is applied to the material that is to be milled.
The ion miller then enters the picture. An ion beam etches the wafer removing material not protected by photoresist. This creates the circuit on the substrate.
The final step is the Dicing process in which the individual circuits are cut out of the large wafers, cleaned, inspected, packed, and shipped.
Ion Beam Milling invites you to click on any of the links above to get more detail about each of the services we provide.