Ion Beam Milling Inc. Ultra Precision Thin Film Circuits Call: 603.644.2326
Fax: 603.647.6889


1000 East Industrial Park Drive
Manchester, NH 03109
Ultra Precision Thin Film Circuits Since 1982 info@ionbeammilling.com

 

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   Visit Us at IMS 2008
   International Microwave Symposium Trade Show
     June 15 - 20, 2008
      Visit Booth # 932


Call: 603.644.2326
Fax: 603.647.6889


1000 East Industrial Park Drive
Manchester, NH 03109


info@ionbeammilling.com


 
Custom Thin Film Circuits


Laser Diode Submounts

Laser Diode Submounts (Heat Spreaders): Ultra precise patterning (+/-3 micron tolerance) of thin film metals on high thermal conductivity dielectrics are used for diode submount (heat spreader) applications.

Edge emitting laser diodes operating at high current densities require a heat spreader placed between the device active region and metal carrier package. Metal pads, for diode mounting, on the top surface edge of the submount, facilitate the diode edge mount requirements at edge gap geometrics down to 5 microns.

Au/Sn selective deposition on the Ti/Pt/Au edge pads precludes the need for small solder preform handling and potential solder rollup in critical submount edge areas.

Submount Material Characteristics
Dielectric Material Thermal Conductivity (w/mk) TCE
(PPM/°C)
Dielectric Constant
Alumina (99.6%) 26 to 27 7.2 9.9
Aluminum Nitride 170 to 210 4.6 8.9
Beryllia Ceramic 260 to 290 8.5 6.7
CVD Diamond 1000 to 1200 2.5 5.7

 

Standard Submount Metallizations
Metallization Thickness Comments
Ti/Pt/Au 1KA/1.5KA/5KA Best/Universal Choice
Ti/Ni/Au 1KA/1.5KA/10KA Min Ni Diffusion Above 350°C
Au/Sn (80/20) 3 to 5 microns Chip Preform Replacement

 

 

 


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1000 East Industrial Park Drive
Manchester, NH 03109

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